Mediatek and AMD will co-engineer the AMD RZ600 Series Wi-Fi 6E modules containing MediaTek’s new Filogic 330P chipset. These will power will power next-gen AMD Ryzen-series laptop and desktop PCs in 2022 and beyond.

The focus of the collaboration is to deliver seamless connectivity experiences for customers. The the optimization process included stress testing and ensuring compatibility standards, which may ultimately reduce development time for OEM customers.

Filogic 330P supports the latest connectivity standards of 2×2 Wi-Fi 6 (2.4/5GHz) and 6E (6GHz band up
to 7.125GHz), along with Bluetooth® 5.2 (BT/BLE). The high throughput chipset is ultra-fast with support
for up to 2.4Gbps connectivity, including support for the new 6GHz spectrum at 160MHz channel
bandwidth.

The chipset also integrates MediaTek’s power amplifier (PA) and low noise amplifier (LNA)
technology to help optimize power consumption and reduce design footprint which enables the Filogic
330P chipset to be embedded in laptops of all sizes.

The AMD RZ600 Series Wi-Fi 6E modules expand AMD’s Wi-Fi capabilities, bringing excellent
connectivity solutions to OEMs and end users, whether they are playing the latest interactive games,
working remotely, or completing a big project.

AMD RZ600 Series Wi-Fi 6E Modules specs are as follows:

AMD RZ616 Wi-Fi 6E module

• Wi-Fi 6E 2×2
• 160MHz Wi-Fi Channels
• PHY rate up to 2.4Gbps
• M.2 2230 and 1216

AMD RZ608 Wi-Fi 6E module

• Wi-Fi 6E 2×2
• 80MHz Wi-Fi Channels
• PHY rate up to 1.2Gbps
• M.2 2230