News

Huawei Mate 20 Pro appears in full body renders, shows off three colors

Just launch the phone already!

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Following the case render leaks, we now have bare Mate 20 Pro renders that show us how Huawei‘s upcoming flagship phone will look. With countless leaks coming left and right, is there’s anything we still don’t know about this phone?

The Mate 20 Pro will virtually look like an offspring of the iPhone XS and Galaxy S9 with an AMOLED display sporting a wide notch on top and curved edges on the sides. Huawei made sure that they will offer the thinnest side bezels possible, but they didn’t bother working on the small chin.


The notch will most likely house the front-facing camera, earpiece speaker, and a new Face ID-like technology. If facial recognition isn’t enough, there will also be an in-display fingerprint sensor according to rumors.

Moreover, the rear glass appears to be curved on the sides as well to provide a more comfortable holding position.

What can’t go unnoticed though is the large square-shaped camera module in the middle. This has three camera sensors and a dual-tone LED flash. Leica branding is present too, just like with previous premium Huawei phones.

Interestingly, the Mate 20 Pro will have a distinct red-colored power button. A nice touch that we saw on the P10 series before.

Color options, based on the leaked renders, will include black, blue, and a gradient model.

As for the internals of the Mate 20 Pro, it’s said to have the new Kirin 980 processor with at least 6GB of memory and 128GB of storage. Battery capacity is pretty large at 4200mAh and it supports wireless charging. Lastly, Android 9 Pie will be available out of the box.

Huawei already confirmed that the Mate 20 Pro will be official next month.

Source: WinFuture.de

SEE ALSO: Huawei’s FreeBuds 2 Pro can charge wirelessly on top of Mate 20

Computers

Qualcomm announces 5G variant of the Snapdragon 8cx

In partnership with Lenovo

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5G on smartphones is already established by multiple manufacturers, but how about laptops? Qualcomm and Lenovo collaborated to push next-generation connectivity on notebooks.

Last year’s Snapdragon 8cx chip has been upgraded this year to have 5G connectivity and it’s aptly called the Snapdragon 8cx 5G. While current laptops can have cellular connectivity, it’s not as efficient as Qualcomm’s solution. Essentially, notebooks running on Snapdragon’s 8cx 5G chip are always connected to the internet just like a smartphone, but without the compromise in battery life.


5G means super-fast speeds which will enable Snapdragon 8cx 5G devices to load online files like it’s from local storage. Also, 8K streaming and AR/VR applications will connect seamlessly.

Since Qualcomm’s new 5G SoC is based on its previous version, it still has the key features including multi-gigabit connectivity and multi-day battery life with support for enterprise applications and security. The 5G modem used here is Qualcomm’s own Snapdragon X55 5G. 5G is not yet widely available, but the chip also sports Category 22 LTE with peak speeds of up to 2.5Gbps.

The chip is yet to come to purchasable consumer devices, but we expect it to become available first with Lenovo. Qualcomm promises to showcase more in early 2020 or when 5G is already accessible globally.

SEE ALSO: Snapdragon 855’s official AnTuTu benchmark score beats the competition

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Computex 2019

AMD announces faster 12-core Ryzen chips

Coming in July

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The processing war is starting up again. Fresh out of the oven, AMD has announced a variety of new chips for launch this year. In a recent press conference, Dr. Lisa Su, AMD’s chief executive, presented the company’s future — 12 cores and 7 nanometers.

First up, the 12-core Ryzen 9 3900X CPU will boast a boost clock of 4.6GHz and a base clock of 3.8GHz. It will also sport 70MB of cache memory. Notably, AMD’s new chip will go up against Intel’s Core i9-9920X. Su demonstrated her chip’s performance against Intel’s driver. In comparison, the Ryzen 9 3900X performs more efficiently and cooler than Intel’s chip. Most impressively, AMD’s chip will retail for only US$ 499, a far cry from Intel’s US$ 1,199 price tag.


Likewise, the 8-core Ryzen 7 3700X touts the same improved efficiency. According to Su, the new chip will have a boost clock of 4.4GHz and a base clock of 3.6GHz. It will churn out 15 percent better efficiency than its predecessors. It will also produce only 65 watts of heat when active. The Ryzen 7 3700X will retail for only US$ 329, compared to its rivalling Intel Core i7-9700K’s US$ 385 price tag.

For more power, the Ryzen 7 3800K boasts more performance. Demonstrated on stage, the chip can play modern games remarkably well: 34 percent higher frame rate on League of Legends and Counter Strike: Global Offensive; 22 percent higher on PlayerUnknown’s Battlegrounds; 21 percent faster on Overwatch; 15 percent faster on Dota 2; and, 14 percent faster on GTA V. Similarly, it performs 37 percent faster on multi-threaded tasks. It will retail for US$ 399, compared to the Intel Core i9-990K’s US$ 484 price tag.

Besides the iconic Ryzen series, AMD also teased a new initiative: the Navi architecture. Unlike the company’s other offerings, the Navi team will build chips based on the new 7nm architecture. According to Su, the new architecture will ship with the upcoming Radeon RX 5000 series. Compared to Nvidia’s GeForce RTX 2070, the upcoming Navi chips will tout higher clock speeds and more efficient power usage. AMD is motivated to do everything better with the Navi architecture.

Unfortunately, AMD has not released a lot of details surrounding the upcoming chip. AMD is delaying a more detailed launch for June’s E3 show. However, the company has confirmed an appropriate July 7 release date for the new 7nm chips.

SEE ALSO: AMD reveals next-generation 7nm graphics card

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News

ASUS ZenFone Max Pro M1 receives global Android Pie update

More features coming up

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The ZenFone Max Pro M1, which had been a mainstay on our Best Smartphones list, is officially seeing its Android 9 Pie update roll out internationally.

This comes a little over a year after the phone’s original launch. According to ASUS’ official online forum, the update is targeting model ZB602KL, which is the international unit. The update’s version number is 16.2017.1905.053.


The update is about 1.5GB in size and can be accessed by checking the System Updates option under System in the main settings menu. ASUS says that the update’s push is happening in batches, so it may take longer for some users to receive it.

The hefty update includes all the features that are bundled with Android Pie, along with the latest security patch from ASUS and some bug fixes.

Last month, only the Indian version of the ZenFone Max Pro M1 could be updated to Android Pie.

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