Computers

New MSI motherboards for Ryzen 7000 announced

To be available later this 2022

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Ryzen 7000

MSI announced the upcoming release of the latest motherboards for its brand-new AMD X670 lineup.

The brand-new motherboards from MSI’s Gaming and PRO series include the following:

  • MEG X670E GODLIKE
  • MEG X670E ACE
  • MPG X670E CARBON WIFI
  • PRO X670-P WIFI

All new motherboards come with support for the upcoming AMD Ryzen 7000 Series processors and MSI’s exclusive M-Vision Dashboard.

The Ryzen 7000 processors will be the first to use the TSMC 5nm FinFET process, as well as introducing the new AMD Socket AM5 platform.

More new features for the processors include:

  • PCIe 5.0 and DDR5 Memory support
  • Rear USB Type-C support for up Display Port 2.0 output
  • Front USB 32 Gen2 x2 Type-C support for up to 60W power delivery
  • Upgraded VRM design for up to 24+2 Power Phases with 105A Smart Power Stage
  • Support for ARB Gen2 devices

Extraordinary upgrades

Such upgrades for the latest processor will definitely benefit users as far as storage, graphics, speed, and more are concerned.

For more details on the upgraded features for the MEG, MPG, and PRO Series motherboards, refer to the table below.

Motherboard Features
MEG X670E GODLIKE
  • E-ATX PCB size
  • Up to 24+2 VRM phases with 105A Smart Power Stage
  • Stacked fin array design heatsink for cooling, MOSFET baseplate
  • Up to 4 onboard M.2 slots including a M.2 PCIe 5.0 x4 slot and a M.2 XPANDER-Z GEN5 DUAL add-on card
MEG X670E ACE
MPG X670E CARBON WIFI
  • 18+2 VRM power phases with 90A
  • Extended heatsink design for cooling
  • EK Water Blocks-customed monoblock cover for VRM and M.2 sections
PRO X670-P WIFI
  • 14+2 Phases Duet Rail Power System
  • Dual 8-pin CPU power connectors
  • 1 M.2 PCIe 5.0 x4 slot
  • 2.5G LAN and WI-FI 6E solution

 

The X670E and X670 motherboards are expected to be available in the fourth quarter of 2022.

 

Computers

AMD expands Ryzen AI Embedded P100 series lineup

Scalable, efficient AI compute for industrial, edge solutions

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AMD has recently announced the expansion of its AMD Ryzen AI Embedded P100 Series processor lineup.

This enables scalable and power-efficient AI compute tailor-built for industrial and AI edge systems. Scenarios include factory automation, physical AI in mobile robotics, and other AI-driven edge applications.

With eight to 12 high-performance Zen 5 cores, AMD ROCm support, and up to 80 total system TOPS, the new x86 embedded APUs deliver up to:

  • 2x more CPU core counts
  • 8x higher GPU compute
  • 36% higher system TOPS

This way, developers and system designers get an expanded and scalable portfolio of power-efficient edge computing solutions. These processors support real-time AI from vision to control and reasoning, as well as offer advanced graphics capabilities.

On a single chip, clients get up to 80 TOPS physical AI acceleration, AMD RDNA 3.5 graphics for real-time visualization, and an NPU based on the AMD XDNA 2 architecture.

Moreover, the processors can withstand industrial temperature ranges (-40° C to 105° C) and can support continuous 24/7 operations for up to 10-year life cycles. That’s along with low-latency and power-efficient AI inference.

Real-life applications include intelligent factories, autonomous robots, and medical imaging devices. For instance, the processors can deliver CPU performance required for real-time inspection and process optimization.

For mobile robots, meanwhile, processors can manage navigation, motion, control, and route planning while the GPU processes multi-camera feeds for spatial awareness.

Furthermore, for 3D health imaging, the processors can enable the powering of 3D imaging for ultrasounds, endoscopes, tissue classification, and tumor detection at the edge. This is done with models like U-Net, nnU-Net, and MONAI.

The processors then accelerate image-to-report workflows with MedSigLIP and support clinical reasoning and Q&A with Med-PaLM 2.

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Computers

GIGABYTE collaborates with Capcom for RE Requiem custom PC

Giveaway runs until March 31

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Resident Evil Requiem

GIGABYTE and Capcom have collaborated for a limited time Resident Evil Requiem-inspired custom PC giveaway.

The setup is inspired by the title, which recently released, and includes an exclusive monitor game bundle to bring players closer to the experience.

Headlining the collaboration is the Umbrella Corporation — Level 3 Access custom rig giveaway. It is one of a kind, fully-built desktop featuring a Z890M AORUS ELITE WIFI7 ICE motherboard and RTX 5080 AERO OC SFF graphics.

Of course, it draws inspiration from the visual identity and atmosphere of Resident Evil Requiem. It also features a GIGABYTE C102 GLASS ICE chassis design and custom GIGABYTE MO27Q28G gaming monitor to complete the setup.

The giveaway runs from March 2 to March 31 via the official campaign website. Fans can enter for a chance to win the custom rig, with no purchase necessary. The only caveat is that they have to be a United States or Canada resident.

Such experience is designed to invite players and PC enthusiasts alike to engage with the collaboration while highlighting GIGABYTE’s premium hardware craftmanship and attention to detail.

In addition to the giveaway, GIGABYTE is also offering a Resident Evil Requiem game bundle with select gaming monitors. Included are AORUS brand monitors, ranging from 27 to 55 inches in size.

This bundle is available until March 31. Customers who purchase eligible models can redeem a digital game code through GIGABYTE’s official redemption platform.

The featured monitor is the MO27Q28G, which has fourth generation WOLED panel with 280Hz refresh rate and 0.03ms response time. It is an ideal monitor to experience the spine-chilling terror and death-defying action of the title.

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Computers

AMD announces Ryzen AI 400, AI 400 PRO series at MWC 2026

Offering support for next-gen AI PCs, Copilot+ experiences

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AMD announced new products and initiatives at MWC 2026 Barcelona, headlined by their newest Ryzen AI 400 and Ryzen AI PRO 400 series processors.

These latest processors are built on the AM5 platform and advanced Zen 5 architecture, delivering next-generation experiences for both consumer and commercial scenarios.

The additions enable original equipment manufacturers (OEMs) to offer next-gen AI PCs across high-performance desktops, laptops, and mobile workstations optimized for modern workloads.

Along with dedicated AMD XDNA 2 NPUs and AMD RDNA 3.5 graphics, both series offer up to 60 TOPS of NPU AI compute, exceeding the requirements of Copilot+ PCs.

As such, these enable powerful on-device AI performance, including running LLMs locally and tackling compute-intensive applications for design and engineering.

The Ryzen AI 400 series processors are also the first for next-gen desktop AI PCs to support Copilot+ PC experiences. Featuring an NPU providing up to 50 TOPS of AI compute, these processors enable running AI assistants and productivity tools locally.

In addition, AMD is expanding the Ryzen AI 400 series mobile portfolio to include workstations. Some that are expected to release in Q2 2026 include products from Dell, HP, and Lenovo.

AMD PRO initiative

Furthermore, AMD announced AMD PRO for enterprise-grade security, manageability, and reliability.

This is done through foundational hardware and software designed to simplify IT operations and protect investments over time.

AMD says it will continue to evolve the AMD PRO platform by strengthening both its silicon foundation and software stack.

This will support enterprise IT teams managing distributed AI-enabled PC fleets. Meanwhile, expanded remote management features improve visibility, recovery, and control.

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