Computers

AMD expands Ryzen AI Embedded P100 series lineup

Scalable, efficient AI compute for industrial, edge solutions

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AMD has recently announced the expansion of its AMD Ryzen AI Embedded P100 Series processor lineup.

This enables scalable and power-efficient AI compute tailor-built for industrial and AI edge systems. Scenarios include factory automation, physical AI in mobile robotics, and other AI-driven edge applications.

With eight to 12 high-performance Zen 5 cores, AMD ROCm support, and up to 80 total system TOPS, the new x86 embedded APUs deliver up to:

  • 2x more CPU core counts
  • 8x higher GPU compute
  • 36% higher system TOPS

This way, developers and system designers get an expanded and scalable portfolio of power-efficient edge computing solutions. These processors support real-time AI from vision to control and reasoning, as well as offer advanced graphics capabilities.

On a single chip, clients get up to 80 TOPS physical AI acceleration, AMD RDNA 3.5 graphics for real-time visualization, and an NPU based on the AMD XDNA 2 architecture.

Moreover, the processors can withstand industrial temperature ranges (-40° C to 105° C) and can support continuous 24/7 operations for up to 10-year life cycles. That’s along with low-latency and power-efficient AI inference.

Real-life applications include intelligent factories, autonomous robots, and medical imaging devices. For instance, the processors can deliver CPU performance required for real-time inspection and process optimization.

For mobile robots, meanwhile, processors can manage navigation, motion, control, and route planning while the GPU processes multi-camera feeds for spatial awareness.

Furthermore, for 3D health imaging, the processors can enable the powering of 3D imaging for ultrasounds, endoscopes, tissue classification, and tumor detection at the edge. This is done with models like U-Net, nnU-Net, and MONAI.

The processors then accelerate image-to-report workflows with MedSigLIP and support clinical reasoning and Q&A with Med-PaLM 2.

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Computers

Samsung’s SECRET That Made OLED Even Better

Say hello to the new QD-OLED Penta Tandem display tech by the Korean giant

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May 23, 2026

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Samsung Display just unveiled QD-OLED Penta Tandem technology. This is a next-generation display structure that stacks five emission layers to improve brightness, efficiency, and overall OLED performance.

In this video, we simplify what Penta Tandem actually is, how it works, and show you two monitors that already have the technology — specifically from MSI and Dell.

For more details, check out Samsung Display here.

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Computers

AMD expands Ryzen PRO 9000 series processor lineup

AMD brings 3D V-Cache technology to commercial segment

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May 20, 2026

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AMD has announced an expansion of its enterprise desktop lineup with new Ryzen PRO 9000 Series processors. These are built on the Zen 5 architecture and set to debut in the second half of 2026.

This is the first time AMD is bringing its high-bandwidth 3D V-Cache technology into the commercial workstation segment.

This way, the company unlocks massive performance leaps for data-heavy professional industries.

The introduction of 3D V-Cache directly targets power users handling complex, intensive digital pipelines.

By vertically stacking additional last-level cache directly onto the processor die, the hardware drastically cuts down memory latency and accelerates data access.

Primary beneficiaries of this architecture are creative and technical professionals, including:

  • video editors and animators
  • 3D artists and VFX creators
  • engineers and architects
  • developers and data scientists

The expanded hardware lineup spans configurations from six to 16 performance cores. Power limits break past traditional limits, or up to a sustained 170 watts to maintain peak clock speeds during overnight renders.

The range also makes the lineup scalable from compact desktop systems to full-scale tower workstation systems.

The AMD Ryzen PRO 9000 series also supports up to 256GB of memory to prevent system crashes. Enterprise system rollouts are expected to begin later this year.

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Computers

AMD to bring FSR Upscaling 4.1 to RDNA 3 GPUs this July

Better visuals for players on PC, consoles soon

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May 20, 2026

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AMD has announced through Senior Vice President and General Manager Jack Huynh that FSR 4.1 upscaling technology is coming to RDNA 3 GPUs this July.

Huynh confirmed that Radeon RX 7000 series graphics cards, among other older graphics architectures, will receive the update in July. Older RDNA 2 cards will also benefit in early 2027.

The decision directly benefits budget-conscious PC gamers and handheld console users who have opted out of expensive hardware upgrades. Instead of having to purchase new GPUs, they will simply have to download the software driver.

FSR (FidelityFX Super Resolution) 4.1 marks a major shift for AMD. It introduces a machine learning-powered algorithm that replaces traditional analytical upscaling.

By updating their software drivers, users can access cleaner image reconstruction, reduced motion ghosting, and better performance with FSR Upscaling 4.1 across more than 300 supported gaming titles on their RDNA 3 graphics.

Beyond desktop players, the rollout carries significant implications for the wider gaming ecosystem.

Devices like the ROG Ally X and Lenovo Legion Go run on RDNA 3 integrated graphics. This means handheld gamers will see immediate frame rate and visual fidelity improvements this summer.

Furthermore, current-generation consoles like the PlayStation 5 and Xbox Series X|S, as well as Valve’s Steam Deck, rely on RDNA 2 architecture. This means AMD’s early 2027 roadmap lays the groundwork for massive visual optimization across the entire console market.

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