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ASUS ZenFone 3, ZenFone 3 Deluxe details, images leaked by design website

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If you’re a fan of ASUS’ budget ZenFone smartphone series, 2016 hasn’t been too kind to you so far. Two major tech conferences have passed, and yet the Internet still hasn’t gotten a solid clue as to what the ZenFone 3 might look like.

The situation is particularly worrisome because it’s already April, and the next-generation ZenFone has been tipped for a launch event at Computex 2016 in June.

Will it have two rear cameras like the LG G5? A curved screen like the Samsung Galaxy S7? A smaller screen to match the trajectory of Apple’s recent product announcements? Or will ASUS surprise the bejeezus out of the industry by unveiling a flip phone, or today’s equivalent of a joke goldmine?

At this point, you might be asking yourself: “When will someone throw a bone to us fans who have been waiting for that bloody phone to show up?”

Wish granted. Meet a couple of leaked — albeit convincing — images of ASUS’ upcoming ZenFone 3 and ZenFone 3 Deluxe. And we’re not using the term “convincing” loosely here. Let us count the ways.

ASUS ZenFone 3 Deluxe leak

ASUS ZenFone 3 Deluxe leaked image

For starters, the images come from Red Dot 21’s design directory. If the name rings a bell, it should, especially in the context of ASUS phones: In 2014, the original ZenFone series bagged the Red Dot design award for mobile devices; the year after that, ASUS won a bunch of other awards for products, including, but not limited to, tablets and notebooks.

So, yes, the connection between Red Dot and the Taiwanese manufacturers is, if nothing else, strong.

A paragraph to describe the ZenFone 3 also appears on the Red Dot website. It reads:

ASUS Zenfone 3 Series is a mainstream smartphone that displays the beauty of craftsmanship and engineering. With 2.5D glass on both front and back sides, we intend to bring the meticulous glass artistry used in watches to smartphone. Beneath those glass lays a thin layer of decoration film with metallic spin texture, portraying the ASUS identity in a new form. A curved aluminum frame offers a robust architecture and a comfortable grip. Zenfone 3 consist of type C USB for speedy charging and file transfer, front flash for selfie in low light situation, laser focus for instant snapshot and finger print recognition for spontaneous ID check.

Going by that description, it sounds like the next ZenFone will have a curved-edge glass on both panels held together by a metal frame, a USB-Type C port with fast-charging capability, front-facing flash, laser autofocus, and a now-ubiquitous fingerprint sensor. It will also support some sort of smart flip cover that lights up to indicate different things.

Meanwhile, the description for the all-metal ZenFone 3 Deluxe reveals far less details.

Metal is the best material to enhance and present the craftsmanship of creating the best smartphone. However, it is also the obstacle to the antenna signal. As the result, the designers and engineers always challenge each other to balance the aesthetic of smartphone appearance design and the possibility of the engineering. Look back to every metallic smartphone, without exception, has some “necessary aesthetic flaws”for antenna on the back. These flaws could be the plastic lines, decorations, etc. By absolutely breaking down the principles of radio transmission, combining the design creative thinking and overcoming the limitation of manufacturing, ASUS Zenfone 3 Deluxe no longer needs to compromise and presents the first full-metallic smartphone in the world.

And then there’s the alleged design of the ZenFone 3: It looks a bit like the outcome of ZenFone Zoom and ZenBook engineers reaching a compromise after months of trying to brainstorm for a smartphone. We’ll let you guys handle the front and sides of the phone — but only if you let us do what we want with the back.

That ASUS would rather take a lot of inspiration from previous ASUS products than go back to the drawing board in an effort to get people excited about the ZenFone 3 seems likely. ASUS isn’t the most adventurous when it comes to designing handsets, after all. And if you need proof, look no further than past ZenFone models.

As always, we’ll keep our eyes and ears open for more details about the ZenFone 3 as they come. For now, feel free to speculate wildly over the authenticity of the images and information from Red Dot’s website.

[irp posts=”3880″ name=”ASUS ZenFone 3 review”]

Source: Red Dot 21, Android Police

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Qualcomm officially launches Snapdragon 8 Gen 1

Coming first late 2021

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A few days ago, Qualcomm officially confirmed a coming name change for its ubiquitous Snapdragon chipset series. Of course, though Qualcomm already announced the change, the company did not reveal the new naming scheme. Now, the mystery is gone. Welcome, the new Snapdragon 8 Gen 1.

Sporting a new coat of paint, the chipset touts an improved 5G modem, the X65 5G. According to the company, the modem can reportedly reach 10Gbps in download speeds. It can also connect to the emerging Wi-Fi 6 standard, allowing up to 3.6Gbps in download speeds. The upper limit won’t mean much in today’s still-young 5G global network. However, it does mean much for the chipset’s longevity.

In the camera department, the chipset sports an 18-bit processor which can supposedly process 4,000 times more data than its predecessor. It can support up to three 36-megapixel cameras simultaneously. It can shoot up to 8K HDR footage at 30 frames per second, UHD footage at 120 frames per second, or slow-mo 720p videos at 960 frames per second.

Qualcomm didn’t specifically indicate how much the Snapdragon 8 Gen 1 differs from the Snapdragon 888 in the performance department. However, it will once again focus on the future of AI. Features that use AI will reportedly get a boost going forward.

According to the company, the first smartphones with the chipset will launch sometime by the end of the year. As expected, more smartphones will come out next year in 2022.

SEE ALSO: Upcoming Snapdragon chipset scores 1000000 on AnTuTu

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Jack Dorsey steps down as Twitter CEO

Successors named

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Twitter’s Jack Dorsey has been as much of a staple for the social media network as Mark Zuckerberg has for Facebook. However, as followers of Apple and Microsoft can attest to, long-standing figureheads of tech can change in an instant. Twitter is suddenly undergoing just that sort of shakeup. In a surprise announcement, Dorsey has announced that he is stepping down as Twitter CEO.

On-brand for his eccentric personality, Dorsey tweeted out the internal email detailing his resignation from his post. According to the email, Dorsey now feels that it is time to transition the company from a “founder-led” system to something potentially greater. He, along with other members of the board, has already appointed successors for his position.

First, now-former Twitter CTO Parag Agrawal will serve as the company’s CEO effective immediately. Agarwal was formerly an engineer with Twitter but has since led the company through several key decisions beside Dorsey.

Secondly, Bret Taylor, a member of Twitter’s board, will eventually serve as the new chairman. Dorsey will still serve the rest of this term until around May. Between now and the end of his term, Dorsey will help both new leaders transition into their new positions.

Though Dorsey’s announcement has a sense of intensity, this isn’t the first time that the Twitter founder exited his position. Back in 2008, he left his post for a time before returning to helm the company again in 2015. Only time will tell whether this current resignation will stick and what role he will transition into now. Regardless, it’s a new era for Twitter.

SEE ALSO: Twitter rolls out soft block feature for everyone

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Dimensity 9000 will reportedly cost double its predecessor

Same with Snapdragon, reportedly

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The end of the year often means the latest generation of smartphone chipsets. Qualcomm and MediaTek, two of the world’s top chipset makers, launch the latest flagship series that will power the following year’s slate of smartphones. Qualcomm already teased a rebranding with their upcoming launch. Now, we have a few more details about MediaTek’s recently launched Dimensity 9000.

Recently, MediaTek launched its next flagship chipset series. The Dimensity 9000 promises impressive performance that can allegedly topple its predecessor’s performance, the Dimensity 1200. However, a promise like that can come with its drawbacks.

Via GizChina, the Dimensity 9000 will reportedly cost double of its predecessor. Though the report does not give actual specifics, it is likely that a more expensive price tag for the processor also comes with an increase in price for the flagship smartphones that it will come with. Next year’s smartphones might come a lot costlier because of the chipset.

If anything, the report also states that the upcoming Snapdragon flagship chipset will also have a higher price tag when it launches soon. As such, most flagships might indeed have higher price tags next year.

Both chipsets have not made their ways to an actual smartphone yet. However, the Snapdragon and Dimensity series do have the most ubiquitous brands for a chipset. If the report does come to pass, we might have to bid our wallets adieu next year.

SEE ALSO: MediaTek announces new Dimensity 9000 chipset

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