Just like the brand’s ethos, TECNO really stops at nothing. From the last tri-foldable concept of 2025, they are also resurrecting the modular phone design — a once imagined “future of mobile phones.”

Dubbed as the Modular Magnetic Interconnection Technology, it could re-shape the way we think about smartphones from 2026 and beyond.

Thinnest modular concept

Just like motorola’s defunct Moto Z line with moto mods from almost ten years ago, TECNO’s modular system uses magnetic attachment plus pogo-pin connectors for power delivery. Data transfers wirelessly (via Wi-Fi, Bluetooth, and even 5G mmWave), so everything pairs almost instantly when you snap a module into place.

The brand says this is its answer to growing AI and performance demands — that without making phones thicker and bulkier.

Surprisingly, it’s oh-so thin as well! The base phone is just 4.9mm. Meanwhile, the modular Power Bank is 4.5mm. When combined, it’s still comparable to thickness of conventional smartphones.

TECNO will showcase around ten (10) modules in this concept ecosystem. Some of those include a power bank, action camera, even a telephoto lens module wasn’t missed out.

That particular module can work as a standalone imaging system. All while using the phone’s display as a viewfinder with low-latency preview.

Moreover, TECNO is presenting two flavors for this concept:

• ATOM edition — Clean silver aluminum with subtle red accents

• MODA edition — A bolder, geek-inspired look

Both keep the glass back and modular alignment zones, which subtly guide where accessories snap into place.

MWC-ready

As mentioned, this is just a concept, not a retail-ready device (just yet). But, the bigger picture is clear: TECNO went back to the drawing board by re-thinking the former modular ecosystem of the yesteryears.

This new modular concept could eventually support AI tools, storage expansion, and lifestyle accessories in the long run. If you’re heading to Barcelona, Spain for MWC 2026 (March 2-5, 2026), you can visit TECNO’s booth at Hall 7, Stand 7A40.

HONOR is redefining cross-OS connectivity with the effortless integration of Apple devices through its three upcoming flagship devices.

At MWC 2026 Barcelona, HONOR will be launching three premium AI-powered devices: the Magic V6, MagicPad4, and MagicBook Pro 14.

These devices will come with an industry-leading cross-OS solution. Such integration enables seamless interaction with an even wider Apple ecosystem which includes the iPhone, iPad, and Mac.

HONOR Share has been supporting transfers to Apple devices for a while now, and this integration will expand what is currently possible.

Among the features are OneTap file transfer with iPhone and Mac for fast and intuitive transfer of photos, videos, and files directly from the Magic V6 to a Mac.

Meanwhile, the MagicPad4 can also enable photo and video transfer both to and from an iPhone. But more than that, the tablet can function as an extended display for the Mac to support tasks like editing.

Furthermore, the MagicBook Pro 14 2026 can transfer images and documents quickly to iPhones and iPads with just a simple click of HONOR Share.

Such integrations make the HONOR flagship devices more than just standalone devices. With consumers operating across platforms, HONOR is ensuring being a topnotch choice for open and fluid connectivity.

HONOR will reveal its first humanoid robot at the Mobile World Congress (MWC) Barcelona 2026.

It hasn’t been a year since HONOR announced entering robotics development, and soon, the manufacturer will officially have its first humanoid robot.

The appearance of the robot can already be previewed in HONOR’s 39-second teaser clip below:

Notably, the narration says “Believe in the magic”. This could suggest HONOR is also naming the robot after its flagship series.

This is on top of the much anticipated HONOR Robot Phone, which has been previewed as early as October 2025 (and also seen on the clip).

This AI-powered robot phone features a built-in, 3-axis gimbal which supports the camera system and can “interact” with the user.

HONOR will also officially announce the HONOR Magic V6, its latest flagship foldable with enhanced durability, larger battery, and even slimmer design.

Plus, two more AI-powered devices will join the ecosystem: the HONOR MagicPad4 and HONOR MagicBook Pro 14. These boost productivity with superior performance in ultra-slim form factors.

All aforementioned products advance HONOR’s Alpha Plan vision of a synergized human-machine future.

They will officially be unveiled during HONOR’s Keynote Launch Event themed “Believers in AI Future” on March 1.

It will be held at the Palau de Congressos de Barcelona starting at 1:00 PM CET.