Computers
Cooler Master is selling a PC shaped like a sneaker
Packing heavy specs too
Are you a sneakerhead and a gamer? If you’re both of these things, we have the perfect PC setup for you. Cooler Master has released a new prebuilt PC designed after a sneaker.
If you take a peek at the PC building market these days, you’ll notice how it’s now possible to create PCs out of a variety of form factors. Now, a shoe certainly pushes the envelope of what a PC should look like, but Cooler Master made it work.
Initially showcased during the Case Mod World Series 2020 (at which the design won an award for best art direction), the Sneaker X packs all the fixings of a PC in the form of a shoe. And it’s not just a looker.
Inside, the PC offers four different options for its processor: Intel i7-13700K, i9-13900K, AMD Ryzen 7800X3D, and Ryzen 7950X3D. Additionally, it offers a selection of GPUs consisting of the RTX 4070, RTX 4070 Ti, and RTX 4080.
Besides these two, the CPU will also have up to 64GB of DDR5 RAM and 2TB of PCIe 4.0 Gen4 NVMe storage. Though the sneaker looks packed, it will have the Master Liquid PL360 Flux Sneaker Edition cooling to keep temperatures at a reasonable level.
In the United States, the Sneaker X is already available in Enthusiast (with an RTX 4070) and in Professional (with an RTX 4070 Ti) models. The Enthusiast retails for US$ 3,499. The Professional sells for US$ 3,799.
The higher trims, armed with AMD processors and the RTX 4080, are exclusive to Europe for now. Prices for these trims can go up to US$ 4,964.
SEE ALSO: MSI, Capcom partner for limited-edition Monster Hunter products
Computers
AMD expands Ryzen PRO 9000 series processor lineup
AMD brings 3D V-Cache technology to commercial segment
AMD has announced an expansion of its enterprise desktop lineup with new Ryzen PRO 9000 Series processors. These are built on the Zen 5 architecture and set to debut in the second half of 2026.
This is the first time AMD is bringing its high-bandwidth 3D V-Cache technology into the commercial workstation segment.
This way, the company unlocks massive performance leaps for data-heavy professional industries.
The introduction of 3D V-Cache directly targets power users handling complex, intensive digital pipelines.
By vertically stacking additional last-level cache directly onto the processor die, the hardware drastically cuts down memory latency and accelerates data access.
Primary beneficiaries of this architecture are creative and technical professionals, including:
- video editors and animators
- 3D artists and VFX creators
- engineers and architects
- developers and data scientists
The expanded hardware lineup spans configurations from six to 16 performance cores. Power limits break past traditional limits, or up to a sustained 170 watts to maintain peak clock speeds during overnight renders.
The range also makes the lineup scalable from compact desktop systems to full-scale tower workstation systems.
The AMD Ryzen PRO 9000 series also supports up to 256GB of memory to prevent system crashes. Enterprise system rollouts are expected to begin later this year.
Computers
AMD to bring FSR Upscaling 4.1 to RDNA 3 GPUs this July
Better visuals for players on PC, consoles soon
AMD has announced through Senior Vice President and General Manager Jack Huynh that FSR 4.1 upscaling technology is coming to RDNA 3 GPUs this July.
Huynh confirmed that Radeon RX 7000 series graphics cards, among other older graphics architectures, will receive the update in July. Older RDNA 2 cards will also benefit in early 2027.
The decision directly benefits budget-conscious PC gamers and handheld console users who have opted out of expensive hardware upgrades. Instead of having to purchase new GPUs, they will simply have to download the software driver.
FSR (FidelityFX Super Resolution) 4.1 marks a major shift for AMD. It introduces a machine learning-powered algorithm that replaces traditional analytical upscaling.
By updating their software drivers, users can access cleaner image reconstruction, reduced motion ghosting, and better performance with FSR Upscaling 4.1 across more than 300 supported gaming titles on their RDNA 3 graphics.
Beyond desktop players, the rollout carries significant implications for the wider gaming ecosystem.
Devices like the ROG Ally X and Lenovo Legion Go run on RDNA 3 integrated graphics. This means handheld gamers will see immediate frame rate and visual fidelity improvements this summer.
Furthermore, current-generation consoles like the PlayStation 5 and Xbox Series X|S, as well as Valve’s Steam Deck, rely on RDNA 2 architecture. This means AMD’s early 2027 roadmap lays the groundwork for massive visual optimization across the entire console market.
Computers
Select GIGABYTE Intel motherboards now support HUDIMM
Offering budget-conscious builders more flexibility, accessibility
GIGABYTE announced a comprehensive BIOS update for its Intel 800, 700, and 600 series motherboards. These motherboards are now support the new HUDIMM memory standard, enabling “One Sub-channel DDR5” technology.
The specification is designed to reduce the high retail costs associated with modern memory by utilizing a single 32-bit sub-channel rather than the standard dual-channel configuration.
This update primarily targets the budget-conscious builders. Even system integrators, who have been restricted by DDR5 market pricing, should benefit.
HUDIMM provides a more accessible entry point for those building on modern Intel platforms, by reducing the DRAM chip count per module.
This is without requiring the premium investment typically demanded by high-bandwidth kits.
Beyond initial builds, the update facilitates unconventional upgrade paths for mainstream users. The firmware allows for asymmetric mixing.
In other words, a user can pair a low-cost 8 GB HUDIMM with an existing 16 GB standard module.
This configuration allows for a 24 GB total capacity, providing a middle-ground performance boost that utilizes three combined sub-channels.
GIGABYTE confirmed the BIOS firmware is available immediately via its official website. The company also stated that the update ensures seamless detection and stable operation of the new modules across its entire compatible Intel motherboard lineup.
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